Chelating resin for removal of nickel impurities from gold electroplating solutions

Industrial and Engineering Chemistry Research

Volumn 52, Issue 6, 2013, Pages 2418-2424

  Pang, Siu Kwong ^a   Yung, Kam Chuen ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE SITE; ADSORPTION EXPERIMENT; ADVERSE EFFECT; AMINOPHOSPHONATE LIGANDS; AU ADSORPTION; CHELATING RESIN; EXPERIMENTAL DATUM; FREUNDLICH ISOTHERM; GOLD ADSORPTION; GOLD CONCENTRATION; GOLD ELECTROPLATING; LANGMUIR ISOTHERM; NI ADSORPTIONS; NICKEL ADSORPTION; NICKEL CONTAMINATION; NICKEL IMPURITIES; NICKEL IONS; PROTONATED; PSEUDO SECOND ORDER KINETICS; PSEUDO-FIRST ORDER KINETICS; SEMICONDUCTOR CHIPS; STYRENE-DIVINYLBENZENE COPOLYMERS; XPS DATA;

ADSORPTION; DYES; GOLD; GOLD DEPOSITS; ION EXCHANGE RESINS; ISOTHERMS; KINETICS; LIGANDS; NICKEL; NICKEL COMPOUNDS; REMOVAL; STYRENE;

ELECTROPLATING SOLUTIONS;

EID: 84873662421     PISSN: 08885885     EISSN: 15205045     Source Type: Journal    
DOI: 10.1021/ie302989v     Document Type: Article

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