Stratification and segregation features of pulverized electronic waste in flowing film concentration

Journal of Environmental Management

Volumn 118, Issue , 2013, Pages 49-54

  Vidyadhar, A ^a   Chalavadi, G ^a   Das, A ^a  

^a NATIONAL CHEMICAL LABORATORY   (India)

Author keywords

Electronic waste; Metal recovery; Printed circuit boards; Settling distance; Tabling

Indexed keywords

DESIGN OF EXPERIMENTS; ELASTOMERS; ELECTRONIC WASTE; FLOW OF WATER; OPEN CIRCUIT VOLTAGE; PRINTED CIRCUIT BOARDS; TIMING CIRCUITS;

E-WASTES; ELECTRONICS WASTES; FLOWING FILM CONCENTRATION; GRAVITY SEPARATION; METALS RECOVERIES; OPTIMUM CONDITIONS; SETTLING DISTANCE; SHAKING TABLES; SINGLE STAGE; TABLING;

METAL RECOVERY;

METAL; PLASTIC;

CONCENTRATION (COMPOSITION); COST-BENEFIT ANALYSIS; ELECTRONIC EQUIPMENT; EXPERIMENTAL DESIGN; FILM; GRAVITY FIELD; INDUSTRIAL PRACTICE; METAL; NUMERICAL MODEL; OPTIMIZATION; PCB; PERFORMANCE ASSESSMENT; PLASTIC; RECYCLING; SEPARATION; SUSTAINABILITY; WATER FLOW;

ARTICLE; ELECTRONIC WASTE; ENVIRONMENTAL SUSTAINABILITY; FILM; FLOW RATE; GRAVITY; METAL RECOVERY; PARTICLE SIZE; PROCESS OPTIMIZATION; SEPARATION TECHNIQUE; SOLID WASTE MANAGEMENT; STRATIFICATION; STREAM (RIVER); WATER FLOW;

EID: 84873543772     PISSN: 03014797     EISSN: 10958630     Source Type: Journal    
DOI: 10.1016/j.jenvman.2013.01.012     Document Type: Article

References (19)

1. Bleiwas D., Kelly T. Obsolete computers, " gold mines" or high-tech trash?. Resource Recovery from Recycling 2001, 7. United States Geological Survey.
2. Cui J., Forssberg E. Mechanical recycling of waste electric and electronic equipment: a review. J. Hazard. Mater. 2003, 99:243-263.
3. Das A., Vidyadhar A., Mehrotra S.P. A novel flow sheet for the recovery of metal values from waste printed circuit boards. Resour. Conserv. Recycl. 2009, 53:464-469.
4. Dey S.K., Vidyadhar A., Das A. Processing of electronic waste in a counter current teeter bed separator. J. Environ. Manage. 2012, 107:45-51.
5. Fornari P., Abbruzzese C. Copper and nickel selective recovery by electrowinning from electronic and galvanic industrial solutions. Hydrometallurgy 1999, 52:209-222.
6. Guo J., Rao Q., Xu Z. Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound. J. Hazard. Mater. 2008, 153:728-734.
7. Guo Q., Yue X., Wang M., Liu Y. Pyrolysis of scrap printed circuit board plastic particles in a fluidized bed. Powder Technol. 2010, 198:422-428.
8. He W., Li G., Ma X., Wang H., Huang J., Xu M., Huang C. WEEE recovery strategies and the WEEE treatment status in China. J. Hazard. Mater. 2006, B136:502-512.
9. Kekesi T., Torok T.I., Kabelik G. Extraction of tin from scrap by chemical and electrochemical methods in alkaline media. Hydrometallurgy 2000, 55:213-222.
10. Ladou J. Printed circuit board industry. Int. J. Hyg. Environ. Health 2006, 209:211-219.
11. Lee C.H., Chang C.T., Fan K.S., Chang T.C. An overview of recycling and treatment of scrap computers. J. Hazard. Mater. 2004, B114:93-100.
12. Lehner, T., 1998. Integrated recycling of non-ferrous metal at Boliden Ltd. In: Proc. The IEEE International Symposium on Electronics and the Environment, pp. 42-47.
13. Park Y.J., Fray D.J. Recovery of high purity precious metals from printed circuit boards. J. Hazard. Mater. 2009, 164:1152-1158.
14. Pozzo R.L., Malicsi A.S., Iwasaki I. Removal of lead from printed circuit board scrap by an electrodissolution-delamination method. Resour. Conserv. Recycl. 1991, 5:21-34.
15. Rao S.R. Recycling metal. Waste Management Series, Resources Recovery and Recycling from Metallurgical Wastes 2006, 7. Elsevier Science. S.R. Rao (Ed.).
16. Veglio F., Quaresima R., Fornari P., Ubaldini S. Recovery of valuable metals from electronic and galvanic industrial wastes by leaching and electrowinning. Waste Manage. 2003, 23:245-252.
17. Veit H.M., Diehl T.R., Salami A.P., Rodrigues J.S., Bernardes A.M., Tenorio J.A.S. Utilization of magnetic and electrostatic separation in the recycling of printed circuit board scrap. Waste Manage. 2005, 25:67-74.
18. Veit H.M., Bernardes A.M., Ferreira J.Z., Tenorio J.A.S., Malfatti C.F. Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgy. J. Hazard. Mater. 2006, B137:1704-1709.
19. Zhang S., Forssberg E. Optimisation of electrodynamic separation for metals recovery from electronic scrap. Resour. Conserv. Recycl. 1998, 22:143-162.