Vias, structural details and their effect on system performance

DesignCon 2012: Where Chipheads Connect

Volumn 2, Issue , 2012, Pages 1397-1421

  Dame, Roger ^a   Blando, Gustavo ^a   Novak, Istvan ^a   Miller, Jason ^a   Hinckley, Kevin ^a  

^a ORACLE CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL IMPEDANCE; HIGH-SPEED SIGNALING; PRACTICAL SOLUTIONS; STRUCTURAL DETAILS;

EID: 84873285351     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Christian Schuster, "Developing a Physical Model for Vias", Proc. of DesignCon 2006, Jan.31-Feb.3 2006, Santa Clara, CA.
2. Giuseppe Selli, "Developing a Physical Model for Vias - Part II: Coupled and Ground Return Vias", Proc. of DesignCon 2007, Jan.29-Feb.1 2007, Santa Clara, CA.
3. Gustavo Blando, et al., "Attenuation in PCB Traces Due to Periodical Discontinuities," DesignCon2006, Santa Clara, CA, February 6-9, 2006
4. Michael Rowlands, "How Long is Too Long? A Via Stub Electrical Performance Study," DesignCon2009, Santa Clara, CA, February 2-5, 2009
5. Dr. Howard Johnson, Via Inductance. Movie available at http://www.sigcon.com/films/index.htm
6. Istvan Novak, Leesa M. Noujeim, Valerie St. Cyr, Nick Biunno, Atul Patel, George Korony, Andy Ritter, "Distributed Matched Bypassing for Board-Level Power Distribution Networks," IEEE Transactions on Advanced Packaging, Vol. 25, No.2, May 2002, pp.230-243