Least angle regression for semiconductor manufacturing modeling

Proceedings of the IEEE International Conference on Control Applications

Volumn , Issue , 2012, Pages 658-663

  Susto, Gian Antonio ^a   Beghi, Alessandro ^a  

^a UNIVERSITY OF PADOVA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH DIMENSIONALITY; HIGH-QUALITY STANDARDS; INDUSTRIAL PRODUCTION; INTERPRETABILITY; MODULE-BASED; SEMICONDUCTOR MANUFACTURING; VIRTUAL METROLOGY;

CHEMICAL VAPOR DEPOSITION; MEASUREMENTS; SEMICONDUCTOR DEVICE MANUFACTURE;

UNITS OF MEASUREMENT;

EID: 84873191087     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CCA.2012.6402409     Document Type: Conference Paper

References (18)

1. A. Beghi and L. Cecchinato. Modeling and adaptive control of small capacity chillers for HVAC applications. Applied Thermal Engineering, 31(6-7):1125-1134, 2011.
2. A. Beghi, L. Cecchinato, G. Cosi, and M. Rampazzo. A PSO-based algorithm for optimal multiple chiller systems operation. Applied Thermal Energy, 32:31-40, 2012.
3. Bradley Efron, Trevor Hastie, Iain Johnstone, and Robert Tibshirani. Least angle regression. Annals of Statistics, 32:407-499, 2004. (Pubitemid 41250302)
4. T. Hastie, R. Tibshirani, and J. Friedman. The Elements of Statistical Learning. Data Mining, Inference and Prediction. Springer, 2009.
5. M.-H. Hung, T.-H. Lin, F.-T. Cheng, and R.-C. Lin. A novel virtual metrology scheme for predicting cvd thickness in semiconductor manufacturing. IEEE Trans. on Mechatronics, pages 308-316, 2007. (Pubitemid 47018782)
6. A. A. Khan, J. R. Moyne, and D. M. Tilbury. Virtual metrology and feedback control for semiconductor manufacturing processes using recursive partial least squares. Jour. of Proc. Cont., 18:961-974, 2008.
7. S. Lynn, et al. Virtual metrology for plasma etch using tool variables. In Proc. ASMC, pages 143-148, 2009.
8. S. Pampuri, A. Schirru, G.A. Susto, A. Beghi, G. DeNicolao, and C. DeLuca. Multistep virtual metrology approaches for semiconductor manufacturing processes. In Proc. IEEE Conf. Aut. Sci. and Eng., 2012.
9. H. Purwins, A. Nagi, B. Barak, U. Hockele, A. Kyek, B. Lenz, G. Pfeifer, and K. Weinzierl. Regression methods for prediction of pevcd silicon nitride layer thickness. In Proc. IEEE Conf. Aut. Sci. and Eng., 2011.
10. E. Ragnoli, S. McLoone, S. Lynn, J. Ringwood, and N. MacGearailt. Identifying key process characteristics and predicting etch rate from high-dimension datasets. In ASMC, 2009.
11. A Schirru, S Pampuri, C DeLuca, and G DeNicolao. Multilevel kernel methods for virtual metrology in semiconductor manufacturing. In IFAC World Congress, 2011.
12. Jun Shao. Linear model selection by cross-validation. Journal of American Statistical Association, 88:486-494, 1993.
13. G A Susto, A Beghi, and C DeLuca. A virtual metrology system for predicting cvd thickness with equipment variables and qualitative clustering. In IEEE Conference on Emerging Technologies & Factory Automation, 2011.
14. G.A. Susto, A. Beghi, and C. DeLuca. A predictive maintenance system for silicon epitaxial deposition. In Proc. IEEE Conf. Aut. Sci. and Eng., pages 262-267, 2011.
15. G.A. Susto, A. Schirru S. Pampuri, G. DeNicolao, and A. Beghi. An information-theory and virtual metrology-based approach to run-torun semiconductor manufacturing control. In IEEE Conf. Aut. Sci. and Eng., 2012.
16. G.A. Susto, A. Schirru, S. Pampuri, and A. Beghi. A predictive maintenance system based on regularization methods for ion-implantation. In Proceeding of 23rd IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 175-180, 2012.
17. Robert Tibshirani. Regression shrinkage and selection via the lasso. Journal of the Royal Statistical Society. Series B (Methodological), 58:267-288, 1996.
18. D. Zeng and C.J. Spanos. Virtual metrology modeling for plasma etch operations. IEEE TSM, 22:419-431, 2009.