Formulation of novel electroless plating process for Cu and Cu-P alloys

International Journal of ChemTech Research

Volumn 5, Issue 1, 2013, Pages 237-245

  Venkatachalam, G ^a   Karthikeyan, S ^a   Hitharth, M ^a   Sumanjeet, K ^a   Narayanan, S ^a  

^a VIT UNIVERSITY   (India)

Author keywords

Cu and cu P alloys; Novel electroless plating process

Indexed keywords

ALLOY; COPPER; COPPER SULFATE; EDETIC ACID; FORMALDEHYDE; PHOSPHORUS;

ARTICLE; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; ELECTROPLATING INDUSTRY; IMPEDANCE; MATERIAL COATING; POLARIZATION; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

EID: 84873049548     PISSN: 09744290     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (31)

1. Lee, H., Wong, S. and Lopatin, S.D Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films, J. Appl. Phys, 2003,3796,93.
2. Brongersma, E. Kerr, Vervoort, I., Saerens, A., Maex, K., Thermodynamics and kinetics of room- temperature micro structural evolution in copper films, J Mater Res, 2002, 582, 17.
3. Hasegawa, M. and Hirai, Y., Microscopic observation of Cu damascene interconnect grains using X-ray mcrobeam J. Appl. Phys, 2792 (2001), 90.
4. Lingk, C., Gross, M.E., Liquid-Phase Deposition of Freestanding Copper Foils and Supported Copper Thin Films and Their Structuring into Conducting Line Patterns J. Appl. Phys., 1998, 5547,84
5. Jiang, Q.T., Gross, M.E., Bersuker, G., Foran, B., Mikkola, R., Carpenter, B., Oemando, J., Electrochemical deposition process for ULSI interconnection devices, Mat. Res. Soc. Symp. Proc.,1999, 429, 564.
6. Lee, H., Nix, W.D., Wong, S.S, Studies of the driving force for room- temperature microstructure evolution in electroplated copper films, J. Vac. Sci. Technol. B, 2004, 2369, 22.
7. Vas'ko, V.A., Tabakovic, I., Riemer, S.C., Kief, M.T., Effect of organic additives on structure, resistivity, and room-temperature recrystallization of electrodeposited copper, Microelectron. Eng., 2004, 71, 75.
8. Steel Vs Copper (2010), Available at www.differencebetween.net.
9. nd Edition (1991).
10. Satas, D., Coating Technology handbook (1991), (Pg. 187-200).
11. Ramanan V. Chebiam and Valery M. Dubin, Electroless Plating Bath Composition and method of using various reducing agents, US7279231, Issue date Oct 9, 2007.
12. Paunovic, M., Plating, 1968,55, 1161.
13. Oldham, K.B., Myland, C., Fundamentals of Electro-chemical Science, Academic Press, New York, (1994).
14. Sviridov et al., Electroless Metal Deposition in Aqueous Solutions, Master of Engineering thesis, Byelorussian University, Minsk, Russia, (1987).(Available on line).
15. Ohno, Haruyama, S., Electrolessdeposition thin films of metals, Bull. Jpn. Inst. Metals., 1981,20, 979.
16. Hung, A., Chen, K.M., Mechanistic insights into metal-mediated electroless copper plating employing hypophosphite as a reducing agent, J. Electrochem. Sot., 1989,136 72.
17. Z.K. Sterlidkina et al., Russian J. Appl.Chem., 1974,47, 451.
18. Jagannathan, R., Krishnan, M., Electroless plating of copper at a low pH level, IBM J. Res. Develop, 1993, 37, 117.
19. Honma, H., Kobayashi, T., Electroless Copper Deposition Process Using Glyoxylic Acid as a Reducing Agent. J. Electrochem. Sot., 1994,141, 730.
20. Van den Meerakker, J.E.A., Side Reactions in Electroless Copper Solutions with Formaldehyde as Reducing Agent. J. Appl. Electrochem., 1981,11 387.
21. Pai, P.L., Ting, C.H., IEEE Electron. Device Left., 1989,10, 423.
22. Zhao, Q., Liu, Y., Comparisons of corrosion rates of Ni-P based composite coatings in HCl and NaCl solutions. Corr. Sci. 47, 2807-2815. (2005).
23. Karthikeyan, S., Studies on formaldehyde free electroless copper deposition, Plating &Surface Finishing (USA),79,(2002), 54-56.
24. Liang Cheng-hao et al, Electrochemical behavior of Cu-Zn-Al shape memory alloy after surface modification by electroless plated Ni-P[J]. Rare Metals, 23(4), (2004), 317-321.
25. Perminder Bindra and James R. White, Fundamentals Aspects of Electroless Copper Plating, 1990,William Andrew publications, USA.
26. Karthikeyan K., et al, Characteristics of Zinc- Cr2O3 composite coatings, Journal of Electroplating & Finishing, China,2011, 30(9), 12-15.
27. Karthikeyan, S., Venkatachalam, G., et al Development of Electroless Ni-P-B4C composite coatings, Journal of Electroplating & Finishing, China, 2011, 30(6),18-20.
28. Karthikeyan, S., Venkatachalam, G., Srinivasan, KN., and Narayanan, S., Development of Electroless Ni-P-Barite composite coatings, Journal of Electroplating & Finishing, China, 2011, 30(3), 31-34.
29. S. Karthikeyan et al, Impedance measurements for electroless nickel plating process, Port. Electrochim. Acta, 2006,24, 405.
30. Ye, X.P., Debonte, M., Celis, J.P., Roos, R., Wear Performance of PECVD TiN and Electroless Composite Ni-P-SiC Hybrid Coatings, J. Electrochem. Soc., 1992,139(6), 1592.
31. Contreras, A., Leó n, C., Jimenez, O., Sosa, E., Pérez, R., Electrochemical behavior and microstructural characterization of 1026 Ni-B coated steel. Appl. Surf. Sci. 2006, 253,592.