Semi-analytical investigation of electronics cooling using developing nanofluid flow in rectangular microchannels

Applied Thermal Engineering

Volumn 52, Issue 2, 2013, Pages 321-327

  Mital, Manu ^a  

^a Virginia Commonwealth University   (United States)

Author keywords

Developing laminar flow; Microchannels; Nanofluids; Nanoparticles

Indexed keywords

CHANNEL WIDTHS; DESIGN VARIABLES; ELECTRONICS COOLING; EXPERIMENTAL STUDIES; HEAT TRANSFER AND FRICTION FACTORS; HIGH DENSITY; LIQUID COOLING; NANOFLUID FLOW; NANOFLUIDS; NANOPARTICLE ADDITION; OBJECTIVE FUNCTIONS; PARTICLE VOLUME FRACTIONS; PUMPING POWER; PURE FLUIDS; RECTANGULAR CHANNEL; RECTANGULAR MICROCHANNELS; SEMI-ANALYTICAL; SEMI-EMPIRICAL CORRELATION; SINGLE-PHASE FLOW;

ALUMINUM; ELECTRONIC COOLING; ELECTRONICS PACKAGING; GENETIC ALGORITHMS; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; LAMINAR FLOW; MICROCHANNELS; NANOPARTICLES; OPTIMIZATION; THERMODYNAMIC PROPERTIES;

NANOFLUIDICS;

EID: 84872298488     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2012.12.020     Document Type: Article

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