Measurement of power-law creep parameters by instrumented indentation methods

Journal of the Mechanics and Physics of Solids

Volumn 61, Issue 2, 2013, Pages 517-536

  Su, Caijun ^a   Herbert, Erik G ^a   Sohn, Sangjoon ^a,d   LaManna, James A ^a,e   Oliver, Warren C ^b   Pharr, George M ^a,c  

^a University of Tennessee   (United States)

^b Nanomechanics Inc   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

^d Cameron's Measurement Systems   (United States)

^e NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Contact mechanics; Creep; Elastic viscoplastic material; Finite elements; Instrumented indentation

Indexed keywords

AMORPHOUS SELENIUM; BERKOVICH INDENTERS; CONSTITUTIVE BEHAVIORS; CONTACT MECHANICS; CREEP STRAIN RATE; CREEP STRESS; ELASTIC-VISCOPLASTIC MATERIAL; FINITE ELEMENT; FINITE ELEMENT SIMULATIONS; INDENTATION CREEP; INDENTERS; INSTRUMENTED INDENTATION; MODEL MATERIALS; NEW EXPERIMENTAL METHOD; POWER LAW CREEP; STRESS EXPONENTS; UNIAXIAL COMPRESSION TESTS; UNIAXIAL CREEP;

COMPRESSION TESTING; ELASTICITY; LOADING; SELENIUM;

CREEP;

EID: 84871446818     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmps.2012.09.009     Document Type: Article

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