Effect of reactor structure in DBD for nonthermal plasma processing of NO in N2 at ambient temperature

Plasma Chemistry and Plasma Processing

Volumn 32, Issue 6, 2012, Pages 1189-1201

  Wang, Tao ^a   Sun, Bao Min ^a   Xiao, Hai Ping ^a   Zeng, Ju Ying ^a   Duan, Er Peng ^a   Xin, Jing ^a   Li, Chun ^b  

^a NORTH CHINA ELECTRIC POWER UNIVERSITY   (China)

^b Thermal Power Co Ltd of National Power Corp   (China)

Author keywords

Dielectric barrier discharge; NO removal; Nonthermal plasma; Reactor structure

Indexed keywords

COAXIAL REACTORS; DIELECTRIC BARRIER DISCHARGE REACTORS; DIELECTRIC BARRIER DISCHARGES; DIFFERENT STRUCTURE; DISCHARGE POWER; ELECTRODE STRUCTURE; EXPERIMENTAL STUDIES; HIGH VOLTAGE; INNER-ELECTRODES; NO REMOVAL; NON-THERMAL PLASMA PROCESSING; NONTHERMAL PLASMA;

DIELECTRIC DEVICES; DIELECTRIC MATERIALS; FLOW CONTROL; NITRIC OXIDE; PLASMA APPLICATIONS; QUARTZ; TUNGSTEN;

ELECTRIC DISCHARGES;

EID: 84870490077     PISSN: 02724324     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11090-012-9399-3     Document Type: Article

References (46)

1. Wang X, Yang Q, Yao C, Zhang X, Sun C (2011) Energies 4:2133-2150
2. Herron JT (2001) Plasma Chem Plasma Process 21:581-609
3. Mizuno A, Shimizu K, Chakrabarti A, Dascalescu L, Furuta S (1995) IEEE Trans Ind Appl 31:957-962
4. Kogelschatz U (2003) Plasma Chem Plasma Process 23:1-46
5. Dorai R, Kushner RJ (2001) J Phys D Appl Phys 34:574-583
6. Fan H-Y, Shi C, Li X-S, Yang X-F, Xu Y, Zhu A-M (2009) Plasma Chem Plasma Process 29:43-53
7. Mok YS, Ravi V, Kang H-C, Rajanikanth BS (2003) IEEE Trans Plasma Sci 31:157-165
8. Jõgi I, Bichevin V, Laan M, Haljaste A, Käämbre H (2009) Plasma Chem Plasma Process 29:205-215
9. Kim H, Jun H, Sakaguchi Y, Minami W (2008) Plasma Sci Technol 10:53-56
10. Daou F, Vincent A, Amouroux J (2003) Plasma Chem Plasma Process 23:309-325
11. Mok YS, Huh YJ (2005) Plasma Chem Plasma Process 25:625-639
12. Sreethawong T, Permsin N, Suttikul T, Chavadej S (2010) Plasma Chem Plasma Process 30:503-524
13. Zhu A-M, Sun Q, Niu J-H, Xu Y, Song Z-M (2005) Plasma Chem Plasma Process 25:371-386
14. Obradović BM, Sretenović GB, Kuraica MM (2011) J Hazard Mater 185:1280-1286
15. Yin S-E, Sun B-M, Gao X-D, Xiao H-P (2009) Plasma Chem Plasma Process 29:421-431
16. Tsai C-H, Wang Y-F, Yang H-H, Liao C-N (2008) J Hazard Mater 150:401-407
17. Mok YS, Koh DJ, Shin DN, Kim KT (2004) Fuel Process Tech 86:303-317
18. Nie Y, Wang J, Zhong K, Wang L, Guan Z (2007) IEEE Trans Plasma Sci 35:663-669
19. Takaki K, Shimizu M, Mukaigawa S, Fujiwara T (2004) IEEE Trans Plasma Sci 32:32-38
20. Teranishi K, Shimomura N, Suzuki S, Itoh H (2009) Plasma Sources Sci Technol 18:045011
21. Du B, Liu H-J, Wang K-F, Wang X-H (2009) High Volt Eng 35:2186-2192 (in Chinese)
22. Masuda S, Nakao H (1990) IEEE Trans Ind Appl 26:374-383
23. Kim D-J, Choi Y, Kim K-S (2001) Plasma Chem Plasma Process 21:625-650
24. van Veldhuizen EM, Rutgers WR, Bityurin VA (1996) Plasma Chem Plasma Process 16:227-247
25. Yan K, Kanazawa S, Ohkubo T, Nomoto Y (1999) Plasma Chem Plasma Process 19:421-443
26. Nakagawa Y, Kawauchi H, Yamaji K (1999) 12th IEEE Int Pulsed Power Conf 2:1309-1312
27. Penetrante BM (1997) 11th IEEE Int Pulsed Power Conf 91-96
28. Baeva M, Gier H, Pott A, Uhlenbusch J, Höschele J, Steinwandel J (2001) Plasma Chem Plasma Process 21:225-247
29. Eliasson B, Kogelschatz U (1991) IEEE Trans Plasma Sci 19:1063-1077
30. Chang MB, Kushner MJ, Rood MJ (1992) Plasma Chem Plasma Process 12:565-580
31. Eliasson B, Kogelschatz U (1991) IEEE Trans Plasma Sci 19:309-323
32. Takaki K, Hatanaka Y, Arima K, Mukaigawa S, Fujiwara T (2009) Vacuum 83:128-132
33. Dou B, Li J, Liang W, Zhu T, Li Y, Jin Y, He L (2008) 2nd Int Conf Bioinforma and Biomed Eng 3945-3948
34. Latham RV (1995) High voltage vacuum insulation: basic concepts and technological practice. Academic Press, London
35. Xu X, Zhu TC (1996) Gas discharge physics. Fudan University Press, Shanghai
36. Hagelaar GJM, Pitchford LC (2005) Plasma Sources Sci Technol 14:722-733
37. Penetrante BM, Hsiao MC, Merritt BT, Vogtlin GE, Wallman PH (1995) IEEE Trans Plasma Sci 23:679-687
38. Fresnet F, Baravian G, Magne L, Pasquiers S, Postel C, Puech V, Rousseau A (2000) Appl Phys Lett 77:4118-4120
39. Li S, Tang Z, Gu F (2010) Heat Mass Transf 46:851-857
40. Golubovskii YB, Maiorov VA, Li P, Lindmayer M (2006) J Phys D Appl Phys 39:1574-1583
41. Bruining H (1954) Physics and applications of secondary electron emission. Pergamon Press, London
42. Konuma M (1992) Film deposition by plasma techniques. Springer, Heidelberg
43. Jin X, Zhang Y, Jiang X, Wang R (1998) China Environ Sci 18:213-217
44. Sun W, Pashaie B, Dhali SK, Honea FI (1996) J Appl Phys 79:3438-3444
45. Wang J, Cai Y-X, Wang J, Wang P, Li X-H (2008) High Volt Eng 34:264-266 (in Chinese)
46. Chiper AS, Cazan R, Popa G (2008) IEEE Trans Plasma Sci 36:2824-2830