Temperature dependence of the structure and shear response of a Σ11 asymmetric tilt grain boundary in copper from molecular-dynamics

Philosophical Magazine

Volumn 92, Issue 34, 2012, Pages 4320-4333

  Fensin, S J ^a,c   Asta, M ^b   Hoagland, R G ^c  

^a University of California   (United States)

^b University of California Berkeley   (United States)

^c LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

Grain boundary; shear response; structure; temperature effect

Indexed keywords

BOUNDARY PLANES; BOUNDARY STRUCTURE; COUPLING PARAMETERS; EFFECT OF TEMPERATURE; EMBEDDED-ATOM MODELS; HOMOLOGOUS TEMPERATURE; IDEAL SHEAR STRENGTH; MOLECULAR DYNAMICS SIMULATIONS; SHEAR RESPONSE; TEMPERATURE DEPENDENCE; TEMPERATURE INCREASE; TILT GRAIN BOUNDARY;

COPPER; MOLECULAR DYNAMICS; STRUCTURE (COMPOSITION); TEMPERATURE DISTRIBUTION; THERMAL EFFECTS;

GRAIN BOUNDARIES;

EID: 84870294808     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786435.2012.705911     Document Type: Article

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