Fatigue and fracture behavior of nanocrystalline copper and nickel

11th International Conference on Fracture 2005, ICF11

Volumn 6, Issue , 2005, Pages 4736-4741

  Bansal, S ^a   Saxena, A ^b   Hartwig, T ^c   Tummala, Rao R ^d  

^a Georgia Institute of Technology   (United States)

^b 3202 Bell Engineering Center   (United States)

^c Texas AandM University   (United States)

^d GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE GRAIN SIZE; ELECTRONIC PACKAGE; EQUICHANNEL ANGULAR EXTRUSIONS; FAR-FIELD; FATIGUE CRACK INITIATION; FATIGUE CRACK PROPAGATION RATE; FRACTURE AND FATIGUE; FRACTURE BEHAVIOR; FRACTURE TOUGHNESS TESTS; J VALUE; NANOCRYSTALLINE (NC) METALS; NANOCRYSTALLINE COPPER; SINGLE EDGE NOTCH BEND SPECIMENS;

FATIGUE CRACK PROPAGATION; FATIGUE OF MATERIALS; NANOCRYSTALLINE MATERIALS; NICKEL;

FRACTURE;

EID: 84869793870     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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