Performance evaluation of the microencapsulated PCM for wood-based flooring application

Energy Conversion and Management

Volumn 64, Issue , 2012, Pages 516-521

  Jeong, Su Gwang ^a   Jeon, Jisoo ^a   Seo, Jungki ^a   Lee, Jeong Hun ^a   Kim, Sumin ^a  

^a Soongsil University   (South Korea)

Author keywords

Adhesive; Energy saving; Heat storage; MPCM; Wood based flooring

Indexed keywords

ADVANCED ENERGY TECHNOLOGIES; BONDING STRENGTH; FLOOR FINISH; FOURIER TRANSFORM INFRARED; HIGH THERMAL; LAMINATE FLOORING; MICROENCAPSULATED PHASE CHANGE MATERIAL; MPCM; PERFORMANCE EVALUATION; RESIDENTIAL BUILDING; SOLID WOODS; SURFACE BONDING; UNIVERSAL TESTING MACHINES; WOOD FLOORING; WOOD-BASED FLOORING;

ADHESIVES; DIFFERENTIAL SCANNING CALORIMETRY; ENERGY CONSERVATION; ENERGY EFFICIENCY; HEAT STORAGE; SCANNING ELECTRON MICROSCOPY; WOOD; WOODEN FLOORS;

BUILDING MATERIALS;

ADHESIVES; CALORIMETRY; ENERGY CONSERVATION; FLOOR COVERINGS; SCANNING ELECTRON MICROSCOPY; WOOD;

EID: 84869499240     PISSN: 01968904     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.enconman.2012.03.007     Document Type: Conference Paper

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