The development of microstructural damage during high temperature creep-fatigue of a nickel alloy

International Journal of Fatigue

Volumn 47, Issue , 2013, Pages 115-125

  Carroll, L J ^a   Cabet, C ^b   Carroll, M C ^a   Wright, R N ^a  

^a IDAHO NATIONAL LABORATORY   (United States)

^b DIF   (France)

Author keywords

Crack paths; Creep fatigue; High temperature fatigue; Intergranular fracture; Microstructures

Indexed keywords

CANDIDATE MATERIALS; CRACK PATHS; CREEP-FATIGUE; CYCLIC TESTS; EX SITU; FRACTURE MODE; HIGH TEMPERATURE; HIGH-TEMPERATURE FATIGUE; HOLD TIME; INITIAL VALUES; INTERGRANULAR; INTERGRANULAR FRACTURE; INTERMEDIATE HEAT EXCHANGER; MICROSTRUCTURAL DAMAGE; MICROSTRUCTURAL INVESTIGATION; SERVICE CONDITIONS; TRANSGRANULAR;

CERIUM ALLOYS; CREEP; FRACTURE; HIGH TEMPERATURE REACTORS; MICROSTRUCTURE; NICKEL ALLOYS; TENSILE STRAIN; TEXTURES;

FATIGUE DAMAGE;

EID: 84869496695     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijfatigue.2012.07.016     Document Type: Article

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