Thermal properties of epoxy resin/filler hybrid composites

Polymer Degradation and Stability

Volumn 97, Issue 11, 2012, Pages 2148-2153

  Jin, Fan Long ^a   Park, Soo Jin ^b  

^a JILIN INSTITUTE OF CHEMICAL TECHNOLOGY   (China)

^b Inha University   (South Korea)

Author keywords

Coefficient of thermal expansion; Epoxy resin; Filler; Glass transition temperature; Thermal stability

Indexed keywords

BLENDING; CURING; FIBER OPTIC SENSORS; FILLERS; GLASS; GLASS TRANSITION; HYBRID MATERIALS; MECHANICAL PROPERTIES; SILICON CARBIDE; TEMPERATURE; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES; THERMODYNAMIC STABILITY;

CURING BEHAVIOR; DIGLYCIDYL ETHER OF BISPHENOL-A; DYNAMIC MECHANICAL PROPERTY; HYBRID COMPOSITES; INTEGRAL PROCEDURE DECOMPOSITION TEMPERATURES; NANO SIC PARTICLES; PEAK TEMPERATURES; THERMAL MECHANICAL PROPERTIES;

EPOXY RESINS;

EID: 84869211261     PISSN: 01413910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymdegradstab.2012.08.015     Document Type: Article

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