Thermal properties of glasses based on Bi2O3 for Pb free solder glasses

Journal of the Ceramic Society of Japan

Volumn 117, Issue SUPPL., 2009, Pages

  Kawanaka, Yuji ^a   Koide, Manabu ^b   Matusita, Kazumasa ^a  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

^b NAGAOKA NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

Author keywords

Bismuth oxide; Bond strength; Pb free; Solder glass; Thermal property

Indexed keywords

BARIUM COMPOUNDS; BISMUTH COMPOUNDS; BOND STRENGTH (MATERIALS); EXPANSION; GLASS; LEAD OXIDE; LEAD-FREE SOLDERS; POLYPROPYLENES; TEMPERATURE; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES;

BISMUTH OXIDES; CRYSTALLIZATION TEMPERATURE; GLASS FORMING REGION; GLASS NETWORK FORMER; PB-FREE; SOLDER GLASS; THERMAL EXPANSION COEFFICIENTS; WATER-RESISTANCES;

GLASS TRANSITION;

EID: 84868874482     PISSN: 18820743     EISSN: 13486535     Source Type: Journal    
DOI: 10.2109/jcersj2.117.s1     Document Type: Article

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