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Volumn 177, Issue 20, 2012, Pages 1759-1763
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A new method for soldering particle-reinforced aluminum metal matrix composites
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Author keywords
Al SiC; Aluminum metal matrix composites; Electroplating Ni; Joining; Kovar 4J29; Soldering
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Indexed keywords
ALUMINUM;
ALUMINUM ALLOYS;
ALUMINUM METALLOGRAPHY;
CADMIUM ALLOYS;
CADMIUM METALLOGRAPHY;
COBALT ALLOYS;
COPPER ALLOYS;
COPPER METALLOGRAPHY;
FRACTURE MECHANICS;
IRON ALLOYS;
JOINING;
LEAD-FREE SOLDERS;
NICKEL ALLOYS;
NICKEL METALLOGRAPHY;
NICKEL PLATING;
PARTICLE REINFORCED COMPOSITES;
SILICON;
SILICON ALLOYS;
SILICON CARBIDE;
SILVER ALLOYS;
SILVER METALLOGRAPHY;
SOLDERING;
TERNARY ALLOYS;
WETTING;
ZINC ALLOYS;
ZINC METALLOGRAPHY;
AL-SIC COMPOSITES;
ALUMINUM METAL MATRIX COMPOSITES;
COHESIVE FAILURES;
ELECTROPLATING NI;
FE-NI-CO ALLOYS;
KOVAR 4J29;
PARTICLE - REINFORCED ALUMINUMS;
WETTING PROPERTY;
METALLIC MATRIX COMPOSITES;
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EID: 84868197722
PISSN: 09215107
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mseb.2012.08.001 Document Type: Article |
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Times cited : (39)
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References (9)
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