Negative thermal expansion and nearly zero temperature coefficient of resistivity in anti-perovskite manganese nitride Mn 3CuN co-doped with Ag and Sn

Cryogenics

Volumn 52, Issue 11, 2012, Pages 629-631

  Chen, Zhen ^a,b   Huang, Rongjin ^a   Chu, Xinxin ^a,b   Wu, Zhixiong ^a,b   Liu, Zhuonan ^a,b   Zhou, Yuan ^a   Li, Laifeng ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Anti perovskite materials; Cryogenic temperatures; Electronic transport; Thermal expansion

Indexed keywords

CO-DOPED; CRYOGENIC ENGINEERING; CRYOGENIC TEMPERATURES; ELECTRICAL RESISTIVITY; ELECTRONIC TRANSPORT; MANGANESE NITRIDES; MECHANICAL BALL MILLING; METALLIC BEHAVIORS; NEGATIVE THERMAL EXPANSION; POTENTIAL APPLICATIONS; SOLID STATE SINTERING; TEMPERATURE RANGE; TESTING TEMPERATURE; ZERO TEMPERATURE COEFFICIENTS;

BALL MILLING; BUOYANCY; ELECTRIC CONDUCTIVITY; NITRIDES; PEROVSKITE; SILVER; SINTERING; TEMPERATURE; THERMAL EXPANSION; THERMOELECTRICITY; TIN;

MANGANESE;

EID: 84867851887     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cryogenics.2012.08.009     Document Type: Article

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