Effect of Micro- and Nano-Particle Fillers at Low Percolation Threshold on the Dielectric and Mechanical Properties of Polyurethane/Copper Composites

Journal of Inorganic and Organometallic Polymers and Materials

Volumn 22, Issue 6, 2012, Pages 1300-1307

  Putson, C ^a   Jaaoh, D ^a   Meauma, N ^a   Muensit, N ^a  

^a PRINCE OF SONGKLA UNIVERSITY   (Thailand)

Author keywords

Dielectric properties; Mechanical properties; Micro copper filler; Nano copper filler; Polyurethane

Indexed keywords

AFM IMAGE; CU CONTENT; DIFFERENTIAL SCANNING CALORIMETRIC MEASUREMENTS; ELONGATION AT BREAK; FILLER CONCENTRATION; FILLER CONTENTS; FRACTURED SURFACES; FREQUENCY RANGES; HOMOGENEOUS DISPERSIONS; METAL FILLERS; MICRO- AND NANO-PARTICLES; MICRO-PARTICLES; NANO COPPER; PERCOLATION THRESHOLDS; POLYMERIC COMPOSITES; POLYMERIC MATRICES; SOLUTION CASTING; TENSILE TESTERS;

COPPER; DIELECTRIC PROPERTIES; DIELECTRIC PROPERTIES OF SOLIDS; DISPERSIONS; MECHANICAL PROPERTIES; NANOPARTICLES; PARTICLE SIZE; POLYMER MATRIX COMPOSITES; POLYMERS; POLYURETHANES; SCANNING ELECTRON MICROSCOPY;

FILLERS;

EID: 84867686915     PISSN: 15741443     EISSN: 15741451     Source Type: Journal    
DOI: 10.1007/s10904-012-9755-z     Document Type: Article

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