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Volumn 112, Issue 7, 2012, Pages

Atomistic investigation of scratching-induced deformation twinning in nanocrystalline Cu

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION MECHANISM; DEFORMATION MODES; DEFORMATION TWIN; DEFORMATION TWINNING; DISLOCATION ACTIVITY; FORMATION MECHANISM; GRAIN BOUNDARY TRIPLE JUNCTIONS; GRAIN SIZE; GRAIN SIZE DEPENDENCE; MOLECULAR DYNAMICS SIMULATIONS; NANOCRYSTALLINE CU; NANOCRYSTALLINE METAL; NANOSCRATCHING; PARTIAL DISLOCATIONS; STRESS STATE; TRIBOLOGICAL BEHAVIORS; TWIN BOUNDARIES; TWIN PLANES;

EID: 84867562005     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4757937     Document Type: Article
Times cited : (26)

References (43)
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    • See for more details about the IMD code.
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  • 35
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  • 43
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    • See supplementary material at E-JAPIAU-112-050220 for dynamic process of twin boundary migration and de-twinning.
    • See supplementary material at http://dx.doi.org/10.1063/1.4757937 E-JAPIAU-112-050220 for dynamic process of twin boundary migration and de-twinning.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.