220-GHz solid-state power amplifier modules

IEEE Journal of Solid-State Circuits

Volumn 47, Issue 10, 2012, Pages 2291-2297

  Radisic, Vesna ^a   Leong, Kevin M K H ^a   Sarkozy, Stephen ^a   Mei, Xiaobing ^a   Yoshida, Wayne ^a   Liu, Po Hsin ^a   Deal, William R ^a   Lai, Richard ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Coplanar waveguide (CPW); HEMT; monolithic microwave integrated circuit (MMIC); power amplifier (PA); solid state power amplifier (SSPA)

Indexed keywords

BURN-IN; COPLANAR WAVEGUIDE TECHNOLOGY; ELECTROMAGNETIC TRANSITIONS; INP HEMT; LIFE-TESTS; ON CHIPS; OUTPUT POWER; PEAK OUTPUT POWER; POWER COMBINING; ROOM TEMPERATURE; SATURATED OUTPUT POWER; SINGLE MODULES; SOLID STATE POWER AMPLIFIER;

HIGH ELECTRON MOBILITY TRANSISTORS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; POWER AMPLIFIERS;

COPLANAR WAVEGUIDES;

EID: 84867405558     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2012.2204923     Document Type: Article

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