Reliability of partially filled SAC305 through-hole joints

IPC - Printed Circuits Expo, Apex, and the Designers Summit 2006: Perfectly Cutting Edge

Volumn 2, Issue , 2006, Pages 740-750

  Ferrer, Ernesto ^a   Benedetto, Elizabeth ^a   Freedman, Gary ^a   Billaut, Francois ^a   Holder, Helen ^a   Gonzalez, David ^b  

^a HEWLETT PACKARD COMPANY   (United States)

^b UNIVERSITY OF PUERTO RICO   (Puerto Rico)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC ASSEMBLIES; FILL LEVEL; FLUX MATERIALS; LEAD FREE SOLDERS; PULL STRENGTH; SAC-SOLDERS; SHOCK AND VIBRATION; SN-3.0AG-0.5CU; THROUGH HOLE;

CUTTING TOOLS; EXHIBITIONS; PRINTED CIRCUITS; SOLDERING ALLOYS;

TIN;

EID: 84866986093     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Lea, C. "The Harmfulness of Re-working Cosmetically Defective Solder Joints." Soldering & Surface Mount Technology, No. 5, June 1990.
2. Wild, R.N. "Thermal Characterization of Multilayer Interconnection Boards - Phase II." IPC 1977 (also IBM No. 77TPA0057).
3. Wild, R.N. "Thermal Characterization of Multilayer Interconnection Boards - Phase III." IPC 1984 (also IBM No. 840TP0059-1).
4. Wild, R.N. "Effect of Backpanel PTH Solder Fill in Life Testing Environment" IBM memo, 1981.
5. Iannuzzelli, R.J., Compaq Computer Corp. Internal Memorandum: Integrity of DIMM PIN-in-PTH Solder Joints - Model Results, October 2001.
6. Tri-Service Evaluation of Field Electronic Hardware. EMPF TR0008, June 1990.