Moisture effects on the performance of RFID tags with ACA joints

IMAPS Nordic Annual Conference 2010, Proceedings

Volumn , Issue , 2010, Pages 110-115

  Saarinen, Kirsi ^a   Frisk, Laura ^a   Ukkonen, Leena ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Anisotropic conductive adhesive; Humidity; Radio frequency identification; Reliability

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; HUMID ENVIRONMENT; HUMIDITY TESTS; MOISTURE EFFECTS; PERFORMANCE PARAMETERS; RADIO FREQUENCY IDENTIFICATION TAGS; RF-ID TAGS; ULTRA-HIGH FREQUENCY;

ADHESIVE JOINTS; ATMOSPHERIC HUMIDITY; CONTACT RESISTANCE; ELECTRONICS PACKAGING; POLYETHYLENE TEREPHTHALATES; RELIABILITY;

RADIO FREQUENCY IDENTIFICATION (RFID);

EID: 84866937629     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

1. P.V. Nikitin and K. V. S. Rao, "Theory and measurement of backscattering from RFID tags," Antennas and Propagation Magazine, IEEE, Vol. 48, No. 6, pp. 212-218, 2006.
2. R. Want, "An Introduction to RFID Technology", IEEE Pervasive Computing, Vol. 5, No. 1, pp. 25-33, 2006.
3. K.V.S. Rao, P.V. Nikitin, and S.F. Lam, "Antenna Design for UHF RFID Tags: A Review and a Practical Application", IEEE Transactions on Antennas and Propagation, Vol. 53, No. 12, pp. 3870-3876, December, 2005.
4. D. Dobkin, "The RF in RFID - Passive UHF RFID in Practice", WJ Communications, San Jose, 504p., 2007.
5. B. An, X. Cai, H. Chu, X. Lai, F. Wu and Y. Wu, "Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive Adhesive", Proceedings of HDP'07, Shanghai, China, pp. 60-63, 2007.
6. X. Cai, B. An, Y. Wu, F. Wu and X. Lai, "Research on the Contact Resistance and Reliability of Flexible RFID Tag Inlays Packaged by Anisotropic Conductive Paste", 9th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP'08), Shanghai, China, July 28-31, pp.129-133, 2008.
7. R.R. Tummala, E.J. Rymanszewski and A.G. Klopfenstein, "Microelectronics Packaging Handbook - Subsystem Packaging, Part III", Chapman & Hall, 2nd edition, United States of America, 628p., 1997.
8. J. Liu, "Conductive Adhesives for Electronics Packaging", Electrochemical Publications Ltd, British Isles, 432p., 1999.
9. L.K. Teh, M. Teo, E. Anto, C.C. Wong, S.G. Mhaisalkar, P.S. Teo and E.H. Wong, "Moisture-Induced Failures of Adhesive Flip Chip Interconnects", IEEE Transactions of Components and Packaging Technologies, Vol. 28, No. 3, pp. 506-516, September, 2005.
10. X. Cai, X. Chen, B. An, F. Wu and Y. Wu, "The Effects of Bonding Parameters on the Reliability Performance of Flexible RFID Tag Inlays Packaged by Anisotropic Conductive Adhesive", 10th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP'09), Beijing, China, August 10-13, pp.1054-1058, 2009.
11. L. Frisk and K. Kokko, "The Effects of Chip and Substrate Thickness on the Reliability of ACA Bonded Flip Chip Joints", Soldering and Surface Mount Technology, Vol. 18, No. 4, pp. 28-37, 2006.
12. Electronic Industries Association, "JEDEC Standard. Steady State Temperature Humidity Bias Life Test. EIA/JESD22-A101-C", United States of America, 6p., 2009.
13. M. Yim and K. Paik, "The Contact Resistance and Reliability of Anisotropic Conductive Film (ACF)", IEEE Transactions on Advanced Packaging, Vol. 22, No. 2, pp. 166-173, 1999.
14. W.D. Callister Jr., "Materials Science and Engineering - An Introduction", John Wiley & Sons, Inc., United States of America, 820p., 2003.
15. M.A. Uddin, M.O. Alam, Y.C. Chan and H.P. Chan, "Adhesion Strength and Contact Resistance of Flip Chip on Flex Packages - Effect of Curing Degree of Anisotropic Conductive Film", Microelectronics Reliability, Vol. 44, No. 3, pp.505-514, 2004.
16. J. Fjelstad, "An Engineer's Guide to Flexible Circuit Technology - Materials, Design, Applications, Manufacturing", Electrochemical Publications Ltd, British Isles, 230p., 1997.
17. C.W. Tan, Y.C. Chan and N.H. Yeung, "Effect of autoclave test on anisotropic conductive joints", Microelectronics Reliability, Vol. 43, No. 2, pp. 279-285, 2003.
18. Y. Chan, K. Hung, C. Tang and C. Wu, "Degradation Mechanisms of Anisotropic Conductive Adhesive Joints for Flip Chip on Flex applications", Proceedings of 4th IEEE Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Espoo, Finland, pp. 141-146, 2000.
19. M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu and A. Sharif, "The Effect of Curing on the Performance of ACF Bonded Chip-on-flex Assemblies After Thermal Ageing", Soldering and Surface Mount Technology, Vol. 17, No. 2, pp.40-48, 2005.