Verifying microvoid elimination and prevention via an optimized immersion silver process

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

Volumn 2, Issue , 2007, Pages 823-833

  Swanson, John ^a   Cullen, Donald ^a  

^a MacDermid Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT BOARDS; ELECTRONIC GOODS; END-USES; IMMERSION SILVER; MICRO VOIDS; MICROVOID; MICROVOIDING; MULTIPLE REFLOW CYCLES; OPTIMIZED PROCESS; PB-FREE; PROCESS SIMPLICITY; ROOT CAUSE; VERIFICATION DATA;

ELECTRONICS INDUSTRY; EXHIBITIONS; LEAD; OPTIMIZATION; PRINTED CIRCUITS;

SOLDERING ALLOYS;

EID: 84866937236     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. IPC Executive Market and Technology Forum 2006 Estimates
2. Cullen, D, "Characterization, Reproduction, and Resolution of Solder Joint Microvoiding", APEX 2005, Anaheim, February 2005
3. Yu et al, "Optimal Reflow Profile fir Lead-free Server Board and Failure Analysis of Solder Joint after Temperature Cyclic Test", TPCA Forum, Taipei 2005
4. Eckel et al, "Impact of PCB Surface Pad Finish and Contamination on BGA Solder Joint Voiding", Pan Pacific Microelectronics Symposium, 2001
5. Coyle et al, "The Effect of Variation in Nickel/Gold Surface Finish on the Assembly Quality and Attachment Reliability of a Plastic Ball Grid Array", IEEE Transactions on Component and Packaging Technologies, December 2003.
6. R. Aspandiar et al, "Planar Microvoiding in Lead-free Second-Level Interconnect Solder Joints", SMTA International, Chicago IL, September 2006
7. R. Aspandiar, "Planar Microvoids", Intel Lead-free Technology Symposium, Scottsdale AZ, March 2006
8. D. Cullen, W. Paw, J. Swanson, L. Toscano, "Eliminating Microvoid Risk via an Optimized Surface Finish Process", CMAP Conference, Toronto, May 2006
9. J. Swanson, "Planar Microvoiding", Intel Lead-free Technology Symposium, Scottsdale AZ, March 2006
10. Y. Yau et al, "A Study of Planar Microvoiding in Pb-free Solder Joints", TPCA Forum, Taipei, October 2006