Effect of OSP chemistry on the hole fill performance during Pb-free wave soldering

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

Volumn 1, Issue , 2007, Pages 421-426

  Nandagopal, Bala ^a   Teng, Sue ^a   Watson, Doug ^b  

^a CISCO SYSTEMS   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

CU LAYERS; DESIGN VARIABLES; HOLE DIAMETER; HOLE SIZE; PB-FREE; PB-FREE WAVE SOLDERING; PCB SURFACE FINISH; PIN DIAMETERS; PLANE LAYERS; PLATED THROUGH HOLE; REFLOW PROCESS; SOLDER PROCESS; WAVE SOLDERING;

DESIGN; EXHIBITIONS; FLIP CHIP DEVICES; LEAD; NITROGEN; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS;

SOLDERING;

EID: 84866931164     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Reliability of Partially Filled SAC305 Solder Joints, Helen Holder, Hewlett Packard Company, IPC/APEX Feb 2006, Anaheim, CA. S29-02-1 - S29-02-11
2. IPC/JEDEC J-STD-020C, "Moisture/Reflow Sensitivity Classification Nonhermetic Solid State Surface Mount Devices", July 2004, www.jedec.org
3. IPC-A-610, "Acceptability of Electronic Assemblies", Feb, 2005, www.ipc.org