Fabrication of ultrafine nanoporous copper by the minor addition of gold

Materials Transactions

Volumn 53, Issue 10, 2012, Pages 1765-1769

  Dan, Zhenhua ^a,b   Qin, Fengxiang ^b   Sugawara, Yu ^a   Muto, Izumi ^a   Hara, Nobuyoshi ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Amorphous alloy; Dealloying; Gold addition; Nanoporous copper; Surface diffusivity

Indexed keywords

AU NANOPARTICLE; BICONTINUOUS; DEALLOYING; HF SOLUTIONS; NANO-POROUS; NANOPOROUS STRUCTURES; SURFACE DIFFUSIVITY; TI-CU ALLOY; ULTRAFINE;

ALLOYS; AMORPHOUS ALLOYS; COPPER; PORE SIZE; SURFACE DIFFUSION;

GOLD;

EID: 84866929060     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MAW201204     Document Type: Article

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