Screen printing process for high density flexible electronics

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2008

Volumn 3, Issue , 2008, Pages 1973-2006

  Turunen, Robert ^a   Numakura, Dominique ^a   Kawasaki, Hisayuki ^b   Nakayama, Masafumi ^b  

^a DKN Research   (United States)

^b NY Industries ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC CIRCUIT SYSTEM; EMBEDDED PASSIVES; FLEXIBLE SUBSTRATE; HIGH DENSITY; SCREEN-PRINTING PROCESS; SINGLE LAYER; VIA HOLE; WHOLE PROCESS;

EXHIBITIONS; SCREEN PRINTING;

PRINTED CIRCUITS;

EID: 84866927650     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. "Screen Printing for High-Density Flexible Electronics", Robert Turunen, Masafumi Nakayama and Dominique Numakura, Printed Circuit FAB, October, 2007.