The advantages of mildly alkaline immersion silver as a final finish for solderability

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

Volumn 2, Issue , 2007, Pages 1151-1221

  Fang, Jing Li ^a   Chan, Daniel K ^a  

^a Chartermate Electronics Limited   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DWELL TIME; IMMERSION SILVER; ORIGINAL EQUIPMENT MANUFACTURERS; PROCESS FLOWS; PRODUCTION LINE; SILVER DEPOSITION; SOLDER DEPOSITS; SOLDERABILITY;

ALKALINITY; CORROSION RESISTANCE; DEPOSITS; EXHIBITIONS; PRINTED CIRCUITS; SOLDERING;

SOLDERING ALLOYS;

EID: 84866896370     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. P. Bratin, Michael Palvov, Gene Chalyt, ECI Technology, "Surface evaluation of the silver finishes via sequential electrochemical reduction analysis", Circuit world, 1999, 25(1):59-64
2. Beigle, S. "Alternative metal finishes for wire bond and soldering applications", Proceedings of the IPC Technical conference, San Jose, CA, March 1996, P.S 9-2
3. Sterling Presentation, Mac Dermid
4. Alpha Level, Presentation, Alpha Metal
5. RAG-14 Immersion Silver, Taiwan Uyemura
6. Redline Ronald et al, "Method for enhancing the solderability of a surface, US Patent, 6.200.451(2001)"
7. Soutar, Andrew Mc Intosh, Alpha Metal, Inc, "Process for Silver plating in printed circuit board manufacture", U.S. Patent, 5 955, 141(1999)
8. Jing Li FANG, "Multiple Complex electroplating", Defense Industry Press, Beijing, China 1983
9. Jing Li FANG, "Comprehensive review of electroplating additives", Surface Technology Press, Taipei, Taiwan, 1998
10. Jing Li FANG, "Theory and application of electroplating additives", Defense
11. Industry Press, Beijing, China, 2006
12. 2S solution Treatment", Proceedings of the 2nd Asian Metal Finishing Forum, Tokyo, June 1-3, 1985.
13. th International coordination Chemistry Conference, Nanjing, China, July 25-30, 1987.