Board level solder joint assembly and reliability for ultra thin BGA packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 43-48

  Hossain, Mohammad M ^a   Aravamudhan, Srinivasa R ^a   Nowakowski, Marilyn ^a   Ma, Xiaoqing ^a   Walwadkar, Satyajit S ^a   Kulkarni, Vijay ^a   Muthukumar, Sriram ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY PACKAGES; BGA PACKAGE; BOARD-LEVEL; BOARD-LEVEL RELIABILITY; ELECTRONIC COMPONENT; FATIGUE LOADINGS; GRID ARRAYS; IMPROVED PROCESS; RELIABILITY PERFORMANCE; SIGNIFICANT IMPACTS; SOLDER JOINTS; TECHNOLOGY OPTIONS; TEMPERATURE CYCLES; THERMO-MECHANICAL ANALYSIS; ULTRA-THIN; WARPAGES;

CONSUMER ELECTRONICS; DYNAMIC MECHANICAL ANALYSIS; LOADING; SURFACE MOUNT TECHNOLOGY; TECHNOLOGY;

RELIABILITY ANALYSIS;

EID: 84866883019     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248804     Document Type: Conference Paper

References (5)

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5. Liu X et al, "Effects of Solder Joint Shape and Height on Thermal Fatigue Lifetime", Components and Packaging Technologies, IEEE Transactions, June 2003, Vol 26, Issue 2, pp. 455-465.