Development of substrates for through glass vias (TGV) for 3DS-IC integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 289-291

  Shorey, Aric ^a   Pollard, Scott ^a   Streltsov, Alex ^a   Piech, Garrett ^a   Wagner, Robert ^a  

^a Corning Incorporated ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITIONAL CHANGES; FORMING PROCESS; GLASS COMPOSITIONS; MECHANICAL AND THERMAL PROPERTIES; POLISHING PROCESSS; THROUGH HOLE;

GLASS; MECHANICAL PROPERTIES;

SUBSTRATES;

EID: 84866848988     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248843     Document Type: Conference Paper

References (4)

1. Adam Ellison and Iván A. Cornejo, Glass Substrates for Liquid Crystal Displays, International Journal of Applied Glass 1 [1] 87-103 (2010)
2. S. M. Dockerty and G. C. Shay, "Down flow Sheet Drawing Method and Apparatus," U.S. Patent No. 3149949, published September 22, 1964.
3. Bocko, Lee, Information Display; 24(5-6): 26-30 (2008).
4. P.-Y. Chen, M.H. Tsai, W-K. Yeh, M-H Jing, Y. Chang, "Relationship between wafer edge design and its ultimate mechanical strength", Microelectronic Engineering 87: 2065-2070 (2010).