Correlation between wear resistance and subsurface recrystallization structure in copper

Wear

Volumn 294-295, Issue , 2012, Pages 438-445

  Yao, B ^a   Han, Z ^a   Lu, K ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Electron microscopy; Hardness; Non ferrous metals; Sliding wear

Indexed keywords

COMPLEX SOLIDS; DOMINANT PROCESS; EXPERIMENTAL INVESTIGATIONS; GRAIN SIZE; METALLIC MATERIAL; MIXING LAYERS; NANO-STRUCTURED; PURE COPPER; SLIDING WEAR; SUBSURFACE STRUCTURES; WEAR RATES;

COPPER; DYNAMIC RECRYSTALLIZATION; ELECTRON MICROSCOPY; HARDNESS;

WEAR OF MATERIALS;

EID: 84866845794     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2012.07.008     Document Type: Article

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