Novel miniaturized packaging for implantable electronic devices

2012 IEEE International Interconnect Technology Conference, IITC 2012

Volumn , Issue , 2012, Pages

  Qian, Karen ^a   De Beeck, Maaike Op ^a   Bryce, George ^a   Malachowski, Karl ^a   Van Hoof, Chris ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BIOCOMPATIBLE PACKAGING; BIOFLUIDS; COMPATIBLE MATERIALS; CORROSION TESTS; DIE ENCAPSULATION; ELECTRONIC SYSTEMS; HERMETICITY; IMPLANTABLE ELECTRONIC DEVICES; INTEGRATION PROCESS;

BIOCOMPATIBILITY; PACKAGING;

BIOLOGICAL MATERIALS;

EID: 84866687839     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2012.6251669     Document Type: Conference Paper

References (5)

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3. M. Op de Beeck, et al, Proc. of ESTC Conf., Sept. 2010.
4. M. Op de Beeck, et al, Proc. of 44th Intern. Symp. on Microelectronics, Long Beach, CA, USA, Oct. 2011.
5. W. A. Lanford, M. J. Rand, J. Appl. Phys. Vol. 49, pp. 2473-2477, 1978