Through silicon via (TSV) design considering technology challenges for very high-speed signal transmission

DesignCon 2011

Volumn 2, Issue , 2011, Pages 1601-1622

  Kim, Namhoon ^a   Wu, Zhaoyin Daniel ^a   Rahman, Arif ^a   Kim, Dongwook ^a   Wu, Paul ^a  

^a XILINX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRITICAL DATA; DC SUPPLIES; ELECTRICAL PERFORMANCE; HIGH-CAPACITIVE; HIGH-FREQUENCY APPLICATIONS; HIGH-FREQUENCY EFFECTS; HIGH-SPEED CHANNELS; HIGH-SPEED SIGNALS; LOW-FREQUENCY SIGNALS; MECHANICAL CONTACT; MODELING AND OPTIMIZATION; NOISE INJECTION; PERFORMANCE DEGRADATION; SILICON SUBSTRATES; TEST VEHICLE; THROUGH-SILICON-VIA; WIDE FREQUENCY RANGE;

CROSSTALK; DEGRADATION;

LOADING;

EID: 84866417186     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Patrick Dorsey, "Xilinx Stacked Silicon Interconnect Technology Delivers Breakthrough FPGA Capacity, Bandwidth, and Power Efficiency", Xilinx White paper: Vertex-7 FPGAs
2. Agilent Application Note, "Ultra-low Impedance Measurements Using 2-port Measurement"