Thermal conductance at atomically clean and disordered silicon/aluminum interfaces: A molecular dynamics simulation study

Journal of Applied Physics

Volumn 112, Issue 5, 2012, Pages

  Ih Choi, Woon ^a,b   Kim, Kwiseon ^a   Narumanchi, Sreekant ^a  

^a NATIONAL RENEWABLE ENERGY LABORATORY   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLASSICAL MOLECULAR DYNAMICS; DIFFUSE MISMATCH MODELS; DISORDERED INTERFACES; ELECTRON PHONON SCATTERING; EXPERIMENTAL DATA; IN-LINE; INTERFACIAL TRANSPORT; MODIFIED EMBEDDED ATOM METHODS; MOLECULAR DYNAMICS MODELING; MOLECULAR DYNAMICS SIMULATIONS; PACKAGING APPLICATIONS; PHONON-PHONON SCATTERING; THERMAL CONDUCTANCE;

DENSITY FUNCTIONAL THEORY; ELECTRONICS PACKAGING; HEAT RESISTANCE; PHONON SCATTERING; PHONONS; THERMAL CONDUCTIVITY;

MOLECULAR DYNAMICS;

EID: 84866355218     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4748872     Document Type: Conference Paper

References (23)

1. D. G. Cahill, W. K. Ford, K. E. Goodson, G. D. Mahan, A. Majumdar, H. J. Maris, R. Merlin, and S. R. Phillpot, J. Appl. Phys. 93, 793 (2003). 10.1063/1.1524305
2. R. J. Stevens, L. V. Zhigilei, and P. M. Norris, Intl. J. Heat Mass Transfer 50, 3977 (2007). 10.1016/j.ijheatmasstransfer.2007.01.040
3. P. K. Schelling, S. R. Phillpot, and P. Keblinksi, Appl. Phys. Lett. 80, 2484 (2002). 10.1063/1.1465106
4. H. Zhao and J. B. Freund, J. Appl. Phys. 97, 024903 (2005). 10.1063/1.1835565
5. T. Watanabe, B. Ni, S. R. Phillpot, P. K. Schelling, and P. Keblinksi, J. Appl. Phys. 102, 063503 (2007). 10.1063/1.2779289
6. C. Kimmer, S. Aubry, A. Skye, and P. K. Schelling, Phys. Rev. B 75, 144105 (2007). 10.1103/PhysRevB.75.144105
7. J. Diao, D. Srivastava, and M. Menon, J. Chem. Phys. 128, 164798 (2008). 10.1063/1.2905211
8. T. S. English, J. C. Duda, J. L. Smoyer, D. A. Jordan, P. M. Norris, and L. Y. Zhigilei, Phys. Rev. B 85, 035438 (2012). 10.1103/PhysRevB.85.035438
9. P. E. Hopkins, P. M. Norris, R. J. Stevens, T. E. Beechem, and S. Graham, ASME J. Heat Transfer 130, 062402 (2008). 10.1115/1.2897344
10. P. E. Hopkins, T. Beechem, J. C. Duda, K. Hattar, J. F. Ihlefeld, M. A. Rodriguez, and E. S. Piekos, Phys. Rev. B 84, 125408 (2011). 10.1103/PhysRevB.84.125408
11. A. Majumdar and P. Reddy, Appl. Phys. Lett. 84, 4768 (2004). 10.1063/1.1758301
12. Z. Lin, L. V. Zhigilei, and V. Celli, Phys. Rev. B 77, 075133 (2008). 10.1103/PhysRevB.77.075133
13. M. I. Baskes, Phys. Rev. B 46, 2727 (1992). 10.1103/PhysRevB.46.2727
14. P. K. Schelling, S. R. Phillpot, and P. Keblinski, Phys. Rev. B 65, 144306 (2002). 10.1103/PhysRevB.65.144306
15. G. Kresse and D. Joubert, Phys. Rev. B 59, 1758 (1999). 10.1103/PhysRevB.59.1758
16. D. Vanderbilt, Phys. Rev. B 41, 7892 (1990). 10.1103/PhysRevB.41.7892
17. M. I. Baskes, J. E. Angelo, and C. L. Bisson, Modelling Simul. Mater. Sci. Eng. 2, 505 (1994). 10.1088/0965-0393/2/3A/006
18. S. Plimpton, J. Comp. Phys. 117, 1 (1995). 10.1006/jcph.1995.1039
19. W. S. Capinski, H. J. Maris, E. Bauser, I. Silier, M. Asen-Palmer, T. Ruf, M. Cardona, and E. Gmelin, Appl. Phys. Lett. 71, 2109 (1997). 10.1063/1.119384
20. P. Reddy, K. Castelino, and A. Majumdar, Appl. Phys. Lett. 87, 211908 (2005). 10.1063/1.2133890
21. P. E. Hopkins, J. Appl. Phys. 106, 013528 (2009). 10.1063/1.3169515
22. P. E. Hopkins, L. M. Phinney, J. R. Serrano, and T. E. Beechem, Phys. Rev. B 82, 085307 (2010). 10.1103/PhysRevB.82.085307
23. S. Shin, M. Kaviany, T. Desai, and R. Bonner, Phys. Rev. B 82, 081302(R) (2010). 10.1103/PhysRevB.82.081302