A promising solution using CVD diamond for efficient cooling of power devices

Materials Science and Engineering: B

Volumn 177, Issue 15, 2012, Pages 1358-1361

  Zhang, Zhongda ^a   Schneider, Henri ^a,b   Tounsi, Patrick ^a,c  

^a LAAS CNRS   (France)

^b UNIVERSITÉ DE TOULOUSE   (France)

^c INSA   (France)

Author keywords

CVD diamond; Heat transfer; MEMS; Power electronics; Thermal resistance

Indexed keywords

ALUMINUM NITRIDE; HEAT TRANSFER; III-V SEMICONDUCTORS; POWER ELECTRONICS; SUBSTRATES;

CVD DIAMOND; DIAMOND CVD; DIAMOND LAYERS; DIAMOND SUBSTRATES; ELECTRICAL INSULATORS; PHYSICAL AND CHEMICAL CHARACTERISTICS; POWER DEVICES; POWER-ELECTRONICS; THERMAL CONDUCTORS; WORKING ENVIRONMENT;

HEAT RESISTANCE;

EID: 84865965709     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2012.03.005     Document Type: Article

References (5)

1. H. Schneider, J.L. Sanchez, and J. Achard EPE2005 - 11th European Conference on Power Electronics and Applications Dresden, Germany, September 2005
2. G. Angelov, S. Tzanova, and Y. Avenas IEEE 36th Power Electronics Specialists Conference, PESC'05 2006
3. J.E. Yater, A. Shih, and R. Abrams Solid-State Electronics 42 December (12) 1998 2225 2232
4. L.S. Pan, and D.R. Kania Diamond: Electronic Properties and Applications 1st ed. 1994, December 31 Springer pp. 285-287
5. Element Six, Thermal Management Grade CVD diamond, www.e6cvd.com, 2011.