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Volumn 72, Issue 10, 2012, Pages 736-744

Systematic examination of thermal, mechanical and dielectrical properties of aromatic polybenzoxazines

Author keywords

Dielectric properties; Mechanical properties; Molecular simulation; Polybenzoxazines; Thermal analysis

Indexed keywords

BISMALEIMIDES; BREAKING STRAIN; DIELECTRICAL PROPERTIES; DYNAMIC VISCOELASTICITY; FLEXURAL MODULUS; HIGH YIELD; HIGH-T; LOW DIELECTRIC LOSS; MOLECULAR SIMULATIONS; POLYBENZOXAZINE; POLYBENZOXAZINES; SYNTHETIC PROCEDURES;

EID: 84865750576     PISSN: 13815148     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.reactfunctpolym.2012.07.001     Document Type: Article
Times cited : (33)

References (29)
  • 5
    • 85013716102 scopus 로고    scopus 로고
    • H. Ishida, T. Agag, Elsevier Amsterdam
    • H. Ishida, T. Agag, Handbook of Polybenzoxazine Resins 2011 Elsevier Amsterdam and references cited therein
    • (2011) Handbook of Polybenzoxazine Resins
  • 8
    • 84865741621 scopus 로고    scopus 로고
    • IPC-TM-650 Test Methods Manual, IPC, 2215 Sanders Road, Northbrook, IL 80062-6135, USA (accessed14.06.11)
    • IPC-TM-650 Test Methods Manual, IPC, 2215 Sanders Road, Northbrook, IL 80062-6135, USA < http://www.akrometrix.com/industrydocs/IPC%20Bow-Twist%202. 4.22c.pdf >, 2011 (accessed 14.06.11).
    • (2011)
  • 10
    • 84865741622 scopus 로고    scopus 로고
    • US Patent 5,543,516, 1996 (to Edison Polymer Innovation Corporation)
    • H. Ishida, US Patent 5,543,516, 1996 (to Edison Polymer Innovation Corporation).
    • Ishida, H.1
  • 12
    • 84865711753 scopus 로고    scopus 로고
    • Reference 5, pp. 85-102
    • Reference 5, pp. 85-102.
  • 22
    • 84865749606 scopus 로고    scopus 로고
    • Epsilon Benzoxazine Resins, Henkel data sheet (accessed14.06.11)
    • Epsilon Benzoxazine Resins, Henkel data sheet < http://www. henkelepsilonresin.com/pdf/Henkel%20BZ%2099110%20SI.ppt.pdf >, 2011 (accessed 14.06.11).
    • (2011)
  • 26
    • 84865741620 scopus 로고    scopus 로고
    • ICP - Institute of Interconnecting and Packaging Electronic Circuits website (accessed29.08.06)
    • ICP - Institute of Interconnecting and Packaging Electronic Circuits website < http://www.ipc.org/4.0-Knowledge/4.1-Standards/test/2.5.5.1b.pdf >, 2006 (accessed 29.08.06).
    • (2006)
  • 27
  • 29
    • 84865739856 scopus 로고
    • Data for 'Compimide 183' from Addition polyimides
    • Springer-Verlag, Berlin
    • Data for 'Compimide 183' from Addition polyimides, in: H.D. Stenzenberger (Ed.), Advances in Polymer Science 117, Springer-Verlag, Berlin, 1994, p. 186.
    • (1994) Advances in Polymer Science 117 , pp. 186
    • Stenzenberger, H.D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.