Soy Protein/Clay Bionanocomposites as Ideal Packaging Materials

Polymer - Plastics Technology and Engineering

Volumn 51, Issue 12, 2012, Pages 1282-1287

  Swain, Sarat K ^a,b   Priyadarshini, Pragnya P ^b   Patra, Subrata K ^b  

^a VEER SURENDRA SAI UNIVERSITY OF TECHNOLOGY   (India)

^b North Orissa University ^*  (India)

Author keywords

Bionanocomposite; Oxygen permeability; Soy protein; Thermal resistance

Indexed keywords

BIO-NANOCOMPOSITE; BIONANOCOMPOSITES; CLAY CONTENT; CLAY LOADINGS; OXYGEN BARRIER PROPERTIES; OXYGEN PERMEABILITY; SOY PROTEIN; TRANSMISSION ELECTRON MICROSCOPY TEM; UV-VISIBLE;

FOURIER TRANSFORM INFRARED SPECTROSCOPY; HEAT RESISTANCE; OXYGEN PERMEABLE MEMBRANES; PACKAGING MATERIALS; THERMOGRAVIMETRIC ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

LOADING;

EID: 84865508470     PISSN: 03602559     EISSN: 15256111     Source Type: Journal    
DOI: 10.1080/03602559.2012.700542     Document Type: Article

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