Kerf-less removal of Si, Ge, and III-V layers by controlled spalling to enable low-cost PV technologies

IEEE Journal of Photovoltaics

Volumn 2, Issue 2, 2012, Pages 141-147

  Bedell, Stephen W ^a   Shahrjerdi, Davood ^a   Hekmatshoar, Bahman ^a   Fogel, Keith ^a   Lauro, Paul A ^a   Ott, John A ^a   Sosa, Norma ^a   Sadana, Devendra ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Flexible photovoltaic (PV); kerf free; layer transfer; substrate reuse

Indexed keywords

CONTINUOUS SURFACE; GE SUBSTRATES; KERF-FREE; LAYER TRANSFER; P-N JUNCTION; PHOTOVOLTAIC; PHOTOVOLTAIC MATERIALS; ROOM TEMPERATURE; SURFACE LAYERS;

EPITAXIAL GROWTH; GERMANIUM; INGOTS; SEMICONDUCTOR JUNCTIONS; SUBSTRATES; SURFACES;

SPALLING;

EID: 84865187924     PISSN: 21563381     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPHOTOV.2012.2184267     Document Type: Article

References (8)

1. J. J. Schermer, P. Mulder, G. J. Bauhuis, M. M. A. J. Voncken, J. van Deelen, E. Haverkamp, and P. K. Larsen, "Epitaxial lift-off for large area thin film III/V devices," Phys. Stat. Sol. (a), vol. 202, pp. 501-508, 2005. (Pubitemid 41365124)
2. M. D. Thouless, A. G. Evans, M. F. Ashby, and J. W. Hutchinson, "The edge cracking and spalling of brittle plates," Acta. Metall., vol. 35, pp. 1333-1341, 1987. (Pubitemid 17586244)
3. Z. Suo and J. W. Hutchinson, "Steady-state cracking in brittle substrates beneath adherent films," Int. J. Solids Struct., vol. 25, pp. 1337-1353, 1989. (Pubitemid 20622676)
4. A. G. Evans, M. D. Drory, andM. S. Hu, "The cracking and decohesion of thin films," J. Mater. Res., vol. 3, pp. 1043-1049, 1988.
5. B. Lawn, Fracture of Brittle Solids, 2nd ed. New York: Cambridge Univ. Press, 1993.
6. J.W.Hutchinson and Z. Suo, "Mixed mode cracking in layered materials," Adv. Appl. Mech., vol. 29, pp. 63-191, 1992.
7. F. Dross, J. Robbelein, B. Vandevelde, E. Van Kerschaver, I. Gordon, G. Beaucarne, and J. Poortmans, "Stress-induced large-Area lift-off of crystalline Si films," Appl. Phys. A, vol. 89, pp. 149-152, 2007. (Pubitemid 350092301)
8. J. A. Thornton and D. W. Hoffman, "Internal stresses in titanium, nickel, molybdenum and tantalum films deposited by cylindrical magnetron sputtering," J. Vac. Sci. Technol., vol. 14, pp. 164-168, 1977.