An alternative polymeric protection mask for bulk KOH etching of silicon

DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2012, Pages 204-207

  Rahim, Rosminazuin Ab ^a   Bais, Badariah ^b   Majlis, Burhanuddin Yeop ^b   Sugandi, Gandi ^b  

^a INTERNATIONAL ISLAMIC UNIVERSITY MALAYSIA   (Malaysia)

^b INSTITUTE OF MICROENGINEERING AND NANOELECTRONICS IMEN   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

BULK MICROMACHINING TECHNOLOGY; DEPTH RATIO; ETCH DEPTH; ETCHING CONDITION; KOH ETCHING; KOH SOLUTION; LATERAL ETCHING; MEMSDEVICES; MICRO-CANTILEVERS; POLYMERIC COATINGS; PROCESS STEPS; PROTECTIVE LAYERS; THERMAL OXIDE LAYER; THERMAL OXIDES;

COATINGS; ETCHING; LIGHT SENSITIVE MATERIALS; PHOTOSENSITIVITY; SILICON NITRIDE;

POLYMERS;

EID: 84864675611     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. K. R. Williams, K. Gupta and M. Wasilik, "Etch rates for micromachining processing-part II," Journal of Microelectromechanical Systems, vol. 12, no. 6, pp. 761-778, 2003.
2. J. Dalvi-Malhotra, X. F. Zhong, C. Planje, G. Brand and K. Yess, "A spin-on photosensitive polymeric etch protection mask for anisotropic wet etching of silicon," J. Micromech. Microeng., 18, pp. 1-8, 2008.
3. R. A. Rahim, B. Bais and B. Y. Majlis, "Hybrid Simulation Approach on Mems Piezoresistive Microcantilever Sensor for Biosensing Applications," Advanced Materials Research, vol. 74, pp. 243-246, 2009.
4. R. A. Rahim, B. Bais and B. Y. Majlis, "Design and analysis of MEMS piezoresistive SiO2 cantilever-based sensor with stress concentration region for biosensing applications," Proc. of 2008 IEEE International Conference on Semiconductor Electronics (ICSE 2008), Kuala Lumpur, Malaysia, pp. 211-215, 2008.
5. J. Dalvi-Malhotra, G. J. Brand and X.-F. Zhong, "Use of silane-based primer on silicon wafers to enhance adhesion of edge-protective coatings during wet etching: application of the TALON wrap process," Proc. SPIE 6462, 2007.