Effect of curing agent and temperature on the rheological behavior of epoxy resin systems

Molecules

Volumn 17, Issue 7, 2012, Pages 8587-8594

  Zhao, Chenhui ^a   Zhang, Guangcheng ^a   Zhao, Lei ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Cure kinetics; Curing agent; Epoxy resins; Rheological behavior

Indexed keywords

EPOXY RESIN;

ARTICLE; CHEMISTRY; FLOW KINETICS; MATERIALS TESTING; METHODOLOGY; TEMPERATURE; VISCOSITY;

EPOXY RESINS; MATERIALS TESTING; RHEOLOGY; TEMPERATURE; VISCOSITY;

EID: 84864599931     PISSN: None     EISSN: 14203049     Source Type: Journal    
DOI: 10.3390/molecules17078587     Document Type: Article

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