Thin film cracking/Delamination evaluation using assembly test chip

1992 International Report on Wafer Level Reliability Workshop, IWLR 1992 - Final Report

Volumn , Issue , 1992, Pages 163-166

  Hong, Charles ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FAILURE (MECHANICAL);

ASSEMBLY TEST CHIP; FAILURE MECHANISM; PLASTIC PACKAGES; PROCESS DEVELOPMENT; TEMPERATURE CYCLING; THIN FILM CRACKING; THIN FILM DELAMINATION; VISUAL TECHNIQUES;

THIN FILMS;

EID: 84864219778     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IWLR.1992.658000     Document Type: Conference Paper

References (0)