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Volumn , Issue , 2011, Pages

Exploiting heat-accelerated flash memory wear-out recovery to enable self-healing SSDs

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY UTILIZATION; FILE ORGANIZATION; MEMORY ARCHITECTURE; MOLECULAR BIOLOGY; NAND CIRCUITS; RECOVERY; SELF-HEALING MATERIALS; SEMICONDUCTOR STORAGE; WEAR OF MATERIALS;

EID: 84863931153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (22)

References (12)
  • 1
    • 2342522065 scopus 로고    scopus 로고
    • Effects of interface trap generation and annihilation on the data retention characteristics of flash memory cells
    • March
    • J.D. Lee, J.H. Choi, D. Park, and K. Kim, “Effects of interface trap generation and annihilation on the data retention characteristics of flash memory cells,” IEEE Transactions on Device and Materials Reliability, vol. 4, pp. 110 - 117, March 2004.
    • (2004) IEEE Transactions on Device and Materials Reliability , vol.4 , pp. 110-117
    • Lee, J.D.1    Choi, J.H.2    Park, D.3    Kim, K.4
  • 9
    • 70450286395 scopus 로고    scopus 로고
    • The performance of PC Solid-state disks (SSDs) as a Function of Bandwidth, Concurrency, device architecture, and system organization
    • C. Dirik and B. Jacob, “The Performance of PC Solid-state disks (SSDs) as a Function of Bandwidth, Concurrency, Device Architecture, and System Organization,” SIGARCH Comput. Archit. News, vol. 37, pp. 279-289, 2009.
    • (2009) SIGARCH Comput. Archit. News , vol.37 , pp. 279-289
    • Dirik, C.1    Jacob, B.2
  • 12
    • 79959961397 scopus 로고    scopus 로고
    • The impact of Lead-Free reflow temperatures on the moisture sensitivity performance of plastic surface mount packages
    • Oct
    • B.T. Vaccaro, R.L. Shook, and D.L. Gerlach, “The impact of Lead-Free reflow temperatures on the moisture sensitivity performance of plastic surface mount packages,” in International Workshop on Thermal Investigations of ICs and Systems, Oct. 2009, pp. 113-116.
    • (2009) International Workshop on Thermal Investigations of ICs and Systems , pp. 113-116
    • Vaccaro, B.T.1    Shook, R.L.2    Gerlach, D.L.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.