Increasing active surface area to fabricate ultra-hydrophobic surface by using "black silicon" with bosch etching process

Journal of Nanoscience and Nanotechnology

Volumn 12, Issue 6, 2012, Pages 4919-4927

  Atthi, Nithi ^a   Supadech, Jakrapong ^a   Dupuy, Gaëtan ^b   Nimittrakoolchai, On Uma ^c   Pankiew, Apirak ^a   Supothina, Sitthisuntorn ^c   Jeamsaksiri, Wutthinan ^a   Hruanun, Charndet ^a   Poyai, Amporn ^a   Brachais, Claire Helene ^b  

^a NATIONAL ELECTRONICS AND COMPUTER TECHNOLOGY CENTER   (Thailand)

^b UNIVERSITÉ DE BOURGOGNE   (France)

^c NATIONAL METAL AND MATERIALS TECHNOLOGY CENTER   (Thailand)

Author keywords

Black Silicon; DRIE; MEMS; Superhydrophobic; Water Repellency

Indexed keywords

ACTIVE SURFACE AREA; BLACK SILICON; DEEP REACTIVE ION ETCHING; DRIE; ELECTROMECHANICAL SYSTEMS; ETCHING PROCESS; LIQUID DROPLETS; OPTIMUM ETCHING CONDITION; SUPERHYDROPHOBIC; WATER CONTACT ANGLE; WATER REPELLENCY;

ASPECT RATIO; COATINGS; CONTACT ANGLE; ETCHING; ETHYLENE GLYCOL; FLUORINE; HYDROPHOBICITY; MEMS; SILICON; SILICON OXIDES; SURFACE CHEMISTRY;

SILICON WAFERS;

NANOMATERIAL; SILICON;

ARTICLE; CHEMICAL PHENOMENA; CHEMISTRY; CONFORMATION; CRYSTALLIZATION; MACROMOLECULE; MATERIALS TESTING; METHODOLOGY; PARTICLE SIZE; PLASMA GAS; SURFACE PROPERTY; ULTRASTRUCTURE;

CRYSTALLIZATION; HYDROPHOBIC AND HYDROPHILIC INTERACTIONS; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MOLECULAR CONFORMATION; NANOSTRUCTURES; PARTICLE SIZE; PLASMA GASES; SILICON; SURFACE PROPERTIES;

EID: 84863900919     PISSN: 15334880     EISSN: 15334899     Source Type: Journal    
DOI: 10.1166/jnn.2012.4906     Document Type: Article

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