Structuration of micro-fluidic devices based on low temperature co-fired ceramic (LTCC) technology

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 243-247

  Birol, H ^a   Maeder, T ^a   Jacq, C ^a   Corradini, G ^a   Fournier, Y ^a   Saglini, I ^a   Straessler, S ^a   Ryser, P ^a  

^a EPFL   (Switzerland)

Author keywords

3 D structuration; LTCC; Porosity elimination; Sacrificial layer

Indexed keywords

CARBON BLACK; DEFECTS; FLUIDIC DEVICES; GRAVIMETRIC ANALYSIS; POROSITY; SCANNING ELECTRON MICROSCOPY; TEMPERATURE; THERMOGRAVIMETRIC ANALYSIS;

FABRICATED STRUCTURES; HIGH-FREQUENCY APPLICATIONS; LOW-TEMPERATURE CO-FIRED CERAMIC TECHNOLOGIES; LTCC; MICRO-FLUIDIC DEVICES; PROCESSING PARAMETERS; SACRIFICIAL LAYER; STRUCTURATION;

MICROELECTRONICS;

EID: 84863835495     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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