Stochastic modeling-based variability analysis of on-chip interconnects

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 7, 2012, Pages 1182-1192

  Ginste, Dries Vande ^a   De Zutter, Daniël ^a   Deschrijver, Dirk ^a   Dhaene, Tom ^a   Manfredi, Paolo ^b   Canavero, Flavio ^b  

^a GHENT UNIVERSITY   (Belgium)

^b POLITECNICO DI TORINO   (Italy)

Author keywords

Multiconductor transmission lines (MTLs); on chip interconnects; stochastic Galerkin method (SGM); variability analysis

Indexed keywords

ELECTROMAGNETIC MODELING; MACRO-MODELS; MANUFACTURING PROCESS; MULTICONDUCTOR TRANSMISSION LINES; ON CHIP INTERCONNECT; ON-CHIP INTERCONNECTS; PARAMETER VARIABILITY; PARAMETERIZED; PER UNIT LENGTH; STOCHASTIC GALERKIN METHODS; TELEGRAPHER'S EQUATIONS; THREE-STEP APPROACH; TRANSMISSION LINE PARAMETERS; VARIABILITY ANALYSIS;

ELECTRIC LINES; GALERKIN METHODS; STOCHASTIC SYSTEMS;

INTERCONNECTION NETWORKS;

EID: 84863774011     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2192274     Document Type: Article

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