Chip-scale demonstration of 3-D integrated intra-chip free-space optical interconnect

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8265, Issue , 2012, Pages

  Wu, Hui ^a   Ciftcioglu, Berkehan ^a   Berman, Rebecca ^b   Hu, Jianyun ^a   Wang, Shang ^a   Savidis, Ioannis ^a   Jain, Manish ^b   Moore, Duncan ^b   Huang, Michael ^a   Friedman, Eby G ^a   Wicks, Gary ^b  

^a Department of Electrical and Computer Engineering ^*  (United States)

^b UNIVERSITY OF ROCHESTER   (United States)

Author keywords

Free space optics; Optical interconnect; Photonic integrated circuits

Indexed keywords

CHIP PROTOTYPES; CHIP-SCALE; FREE SPACE OPTICS; FREE-SPACE OPTICAL; FREE-SPACE OPTICAL LINK; GAAS; GERMANIUM SUBSTRATES; HIGH ENERGY EFFICIENCY; INTEGRATED PHOTODETECTOR; INTERCONNECT SYSTEMS; INTRA-CHIP COMMUNICATIONS; LONG DISTANCE TRANSMISSION; LOW LATENCY; MANY-CORE; MICRO LENS; OPTICAL INTERCONNECT; PHOTONIC INTEGRATED CIRCUITS;

BANDWIDTH; ELECTRIC POWER SYSTEM INTERCONNECTION; ENERGY EFFICIENCY; INTEGRATED OPTOELECTRONICS; INTEGRATION; INTERCONNECTION NETWORKS; THREE DIMENSIONAL; WAVE TRANSMISSION;

OPTICAL INTERCONNECTS;

EID: 84863360766     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.913314     Document Type: Conference Paper

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