Thermal conductivity enhancement of ZnO nanofluid using a one-step physical method

Thermochimica Acta

Volumn 542, Issue , 2012, Pages 24-27

  Lee, Gyoung Ja ^a   Kim, Chang Kyu ^a,b   Lee, Min Ku ^a   Rhee, Chang Kyu ^a   Kim, Seokwon ^c   Kim, Chongyoup ^c  

^a Korea Atomic Energy Research Institute   (South Korea)

^b University of Science and Technology (UST)   (South Korea)

^c Korea University   (South Korea)

Author keywords

Nanofluid; Pulsed wire evaporation; Thermal conductivity; Viscosity; ZnO

Indexed keywords

CALCULATED VALUES; FIXED TEMPERATURE; NANO-FLUID; NANOFLUIDS; NEWTONIAN BEHAVIOR; PHYSICAL METHODS; RHEOLOGICAL BEHAVIORS; TEMPERATURE DEPENDENCIES; THERMAL CONDUCTIVITY ENHANCEMENT; X-RAY DIFFRACTION METHOD; ZNO; ZNO NANOPARTICLES;

ETHYLENE; EVAPORATION; GLYCOLS; NANOPARTICLES; PHASE TRANSITIONS; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF LIQUIDS; TRANSMISSION ELECTRON MICROSCOPY; VISCOSITY; WIRE; X RAY DIFFRACTION; ZINC OXIDE;

NANOFLUIDICS;

EID: 84863331857     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2012.01.010     Document Type: Conference Paper

References (23)

1. J.A. Eastman, S.U.S. Choi, S. Li, W. Yu, and L.J. Thompson Appl. Phys. Lett. 78 2001 718 720
2. S.U.S. Choi, Z.G. Zhang, W. Yu, F.E. Lockwood, and E.A. Grulke Appl. Phys. Lett. 79 2001 2252 2254
3. R. Prasher Phys. Rev. Lett. 2005 94 Article ID 025901
4. S.K. Das, S.U.S. Choi, and H.E. Patel Heat Transfer Eng. 27 2006 3 19
5. S.P. Jang, and S.U.S. Choi J. Heat Transfer 129 2007 617 623
6. W. Yu, D.M. France, J.L. Routbort, and S.U.S. Choi Heat Transfer Eng. 29 2008 432 460
7. H.E. Patel, T. Sundararajan, and S.K. Das J. Nanopart. Res. 12 2010 1015 1031
8. Y.R. Uhm, W.W. Kim, S.J. Kim, C.S. Kim, and C.K. Rhee J. Appl. Phys. 93 2003 7196 7198
9. Y.R. Uhm, J.H. Park, W.W. Kim, C.-H. Cho, and C.K. Rhee Mater. Sci. Eng. B 106 2004 224 227
10. H.M. Lee, Y.R. Uhm, and C.K. Rhee J. Alloys Compd. 461 2008 604 607
11. C.K. Kim, G.-J. Lee, and C.K. Rhee J. Korean Powder Metall. Inst. 17 2010 270 275
12. C.K. Kim, G.-J. Lee, and C.K. Rhee J. Korean Powder Metall. Inst. 17 2010 276 280
13. C.H. Chon, K.D. Kihm, S.P. Lee, and S.U.S. Choi Appl. Phys. Lett. 87 2005 Article ID 153107
14. R.S. Vajjha, and D.K. Das Int. J. Heat Mass Transfer 52 2009 4675 4682
15. B.X. Wang, L.P. Zhou, and X.F. Peng Int. J. Heat Mass Transfer 46 2003 2665 2672
16. R. Prasher, W. Evans, P. Meakin, J. Fish, P. Phelan, and P. Keblinski Appl. Phys. Lett. 89 2006 Article ID 143119
17. H. Zhu, C. Zhang, S. Liu, Y. Tang, and Y. Yin Appl. Phys. Lett. 2006 89 Article ID 023123
18. N.R. Karthikeyan, J. Philip, and B. Raj Mater. Chem. Phys. 109 2008 50 55
19. P.E. Gharagozloo, J.K. Eaton, and K.E. Goodson Appl. Phys. Lett. 93 2008 Article ID 103110
20. R.L. Hamilton, and O.K. Crosser Ind. Eng. Chem. Fund. 1 1962 187 191
21. S.H. Kim, S.R. Choi, and D.S. Kim ASME J. Heat Transfer 129 2007 298 307
22. W. Yu, H. Xie, L. Chen, and Y. Li Thermochim. Acta 491 2009 92 96
23. M. Moosavi, E.K. Goharshadi, and A. Youssefi Int. J. Heat Fluid Flow 31 2010 599 605