The effect of various dopants on thermoelectric properties of Bi2(Te0.9Se0.1)3 polycrystals

International Conference on Thermoelectrics, ICT, Proceedings

Volumn 2003-January, Issue , 2003, Pages 31-33

  Nozue, A ^a   Park, Y H ^b   Kawasaki, A ^c  

^a PANASONIC CORPORATION   (Japan)

^b Pusan National University   (South Korea)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

Additives; Alloying; Bismuth; Copper; Crystal microstructure; Crystallography; Silver; Tellurium; Thermoelectricity; X ray scattering

Indexed keywords

ADDITIVES; ALLOYING; BISMUTH; CARRIER CONCENTRATION; COPPER; CRYSTAL MICROSTRUCTURE; CRYSTALLOGRAPHY; CRYSTALS; ELECTRIC POWER FACTOR; HOT PRESSING; MECHANICAL ALLOYING; SILVER; SILVER HALIDES; SINTERING; TELLURIUM; TELLURIUM COMPOUNDS; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY; X RAY CRYSTALLOGRAPHY; X RAY SCATTERING;

CRYSTALLOGRAPHIC ORIENTATIONS; HOT-PRESSING PROCESS; METAL ELEMENTS; MICRO-STRUCTURAL CHARACTERIZATION; PULSE DISCHARGE SINTERING; THERMO-ELECTRIC MATERIALS; THERMOELECTRIC PERFORMANCE; THERMOELECTRIC PROPERTIES;

CRYSTAL ORIENTATION;

EID: 84863278411     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICT.2003.1287442     Document Type: Conference Paper

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