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Volumn 35, Issue 3 PART 3, 2011, Pages 2489-2502

Electrodeposition of CoMn onto stainless steels interconnects for increased lifetimes in SOFCs

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY COATINGS; BATCH MANUFACTURING; CHROMIA; COATING PERFORMANCE; COATING TECHNOLOGIES; COATING THICKNESS; COST EFFECTIVE; CRACK FREE; DIFFUSION AND OXIDATION; ELECTROCHEMICAL DEPOSITION PROCESS; FARADAY TECHNOLOGIES; FUEL CELL STACK; POST-DEPOSITION; PULSE-REVERSE ELECTRODEPOSITION;

EID: 84863161228     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3570247     Document Type: Conference Paper
Times cited : (9)

References (14)
  • 13
    • 84878427647 scopus 로고    scopus 로고
    • Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
    • U.S. Patent No. 7,553,401
    • L. Gebhart, J. Sun, P. Miller, E.J. Taylor, "Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating," U.S. Patent No. 7,553,401, 2010.
    • (2010)
    • Gebhart, L.1    Sun, J.2    Miller, P.3    Taylor, E.J.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.