Characterization of Al/Cu/W bond pad micro-corrosion

Proceedings - International Symposium on Advanced Packaging Materials

Volumn , Issue , 2011, Pages 234-238

  Gong, Guo Liang ^a   Li, Li ^a   Liu, Wei ^a   Song, Mei Jiang ^a   Xu, Xue Song ^a   Ye, De Hong ^a   Yao, Jin Zhong ^a  

^a Freescale Inc   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AL OXIDE; BOND PAD; ELECTRICAL PATH; GALVANIC CELLS; THETA PHASE; WATER CLEANING PROCESS;

ALUMINUM; ANODIC OXIDATION; CHARACTERIZATION; CLEANING; CORROSION; LEAD; METAL CLEANING; PACKAGING;

PACKAGING MATERIALS;

EID: 84863046587     PISSN: 15505723     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2011.6105706     Document Type: Conference Paper

References (10)

1. I. Ames, F. M. d'Heurle, and R. E. Horstman, "Reduction of electromigration in aluminum films by copper doping", IBM J. Res. Dev., vol.14, (1970) p. 461.
2. F. M. d'Heurle, "The effect of copper additions on electromigration in aluminum thin films", Metall. Trans., vol. 2, (1971) p. 683.
3. R. Rosenberg, M. J. Sullivan, and J. K. Howard, Thin Films-Interdiffusion and Reactions, J. M. Poate, New York: Wiley, .1978.
4. P. A. Totta, "Inprocess intergranular corrosion in Al alloy thin films", J. Vac. Sci. Technol., vol. 13, (1976) p. 26
5. SIMON THOMAS AND HOWARD M. BERG, "Micro-Corrosion of Al-Cu Bonding Pads", Reliability Physics Symposium, 23rd Annual, Orlando, FL, March. 1985, pp. 153-158.
6. Hua Younan, Chee Eddy, and Shailesh Redkar, "Investigation and Elimination of Discolored Bond pads on Microchip", ICSE2002 Proceedings, Penang, Malaysia, pp. 383-387.
7. "Characterization of Pad Surface Defect by TEM, SEM and EDX", 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Jiangsu, China, July. 2009, pp.535-537.
8. th, California. USA, July. 2006, pp:6
9. S. Mader and S. Herd, "Formation of second phase particles in aluminum-copper alloy films",Thin Solid Films, vol. 10, (1972) pp. 377-389,
10. G. A. Walker and C. C. Gold smith, "Precipitation and solid solution effects in aluminum - copper thin films and their influence on electromigration ", J. Appl. Phys., vol. 44,(1973) p. 2452.