Effects of colloidal nanosilica on the rheological properties of epoxy resins filled with organoclay

Journal of Nanoscience and Nanotechnology

Volumn 11, Issue 5, 2011, Pages 4448-4451

  Nguyen, Dinh Huong ^a   Song, Gwang Seok ^a   Lee, Dai Soo ^a  

^a Chonbuk National University   (South Korea)

Author keywords

Colloidal nanosilica; Epoxy resin; Organoclay; Rheology

Indexed keywords

COLLOIDAL SILICA; FILLED EPOXY RESINS; FLOW MODES; NANO-SILICA; PARALLEL PLATE RHEOMETERS; RHEOLOGICAL PROPERTY; SHEAR THICKENING; SHEAR-THINNING BEHAVIOR; SILICATE LAYERS;

ORGANOCLAY; RESINS; RHEOLOGY; SILICA; SILICATES;

EPOXY RESINS;

EID: 84863012516     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2011.3685     Document Type: Conference Paper

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