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Volumn 21, Issue 1, 2012, Pages 34-38
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Bonding interface between TiAl intermetallic compound and Ti under the electric field
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Author keywords
Combustion synthesis; Diffusion bonding; Electric field; Interface; Intermetallic compounds
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Indexed keywords
BONDING INTERFACES;
DIFFUSION DISSOLUTION;
ELEMENTS DISTRIBUTION;
GROWTH PATTERNS;
METALLURGICAL BONDS;
OPTICAL MICROSCOPES;
TI SUBSTRATES;
TIAL INTERMETALLIC COMPOUND;
COMBUSTION SYNTHESIS;
DIFFUSION BONDING;
DIFFUSION IN SOLIDS;
ELECTRIC FIELDS;
ENERGY DISPERSIVE SPECTROSCOPY;
INTERFACES (MATERIALS);
MICROSTRUCTURE;
SCANNING ELECTRON MICROSCOPY;
SINTERING;
SOLDERING ALLOYS;
TITANIUM ALLOYS;
TITANIUM COMPOUNDS;
INTERMETALLICS;
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EID: 84862994230
PISSN: 10045341
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (1)
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References (12)
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